LPDDR4

LPDDR, renowned for its low power consumption and compact form factor, is purposely built for mobile electronic devices. Xi’an UniIC’s LPDDR4 series incorporated Embedded Error-Correction Code (ECC), ensuring not only higher performance and lower power consumption but also enhanced reliability. 

Part No. Den. Org. Voltage Package Dim.(mm) Status Speed Temperature Model
SCB11N32322EF

32Gb

1024Mbx32

1.1V

TFBGA200

10x14.5

MP

3733/4266

C I

SCE11U64324EF

64Gb

2048Mbx32

1.1V

TFBGA200

10x14.5

ES

3733/4266

 I A3 A2

SCE11U48324AF

48Gb

1536Mbx32

1.1V

TFBGA200

10x14.5

ES

3733/4266

 I A3 A2

SCE11U32322FF

32Gb

1024Mbx32

1.1V

TFBGA200

10x14.5

ES

3733/4266

 I A3 A2

SCE11U32322EF

32Gb

1024Mbx32

1.1V

TFBGA200

10x14.5

ES

3733/4266

 I A3 A2

SCE11U16320FF

16Gb

512Mbx32

1.1V

TFBGA200

10x14.5

ES

3733/4266

 I A3 A2

SCE11N8G322AF

8Gb

256Mbx32

1.1V

TFBGA200

10x14.5

MP

3200/2400/1600

 I A3 A2

IBIS

SCE11N4G160AF

4Gb

256Mbx16

1.1V

TFBGA200

10x14.5

MP

3200/2400/1600

 I A3 A2

IBIS

SCE11N4G320AF

4Gb

128Mbx32

1.1V

TFBGA200

10x14.5

MP

3200/2400/1600

 I A3 A2

IBIS

SCE11N2G160AF

2Gb

128Mbx16

1.1V

TFBGA200

10x14.5

MP

3200/2400/1600

 I A3 A2

IBIS

Notes

  • Temperature Specification:

    C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C;SDR, DDR: 0°C ~ +70°C)

    I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)

    A1 = Automotive grade 1(-40°C ~ +125°C)

    A2 = Automotive grade 2(-40°C ~ +105°C)

    A25 = Automotive grade 2(-40°C ~ +115°C)

    A3 = Automotive grade 3(-40°C ~ +95°C);LPDDR4(-40°C ~ +85°C)