Xi' an UniIC has developed an extensive range of memory chip products, encompassing standard SDR, DDR, DDR2, DDR3, DDR4, and mobile LPDDR, LPDDR2, LPDDR4, of which more than 20 products have achieved global mass production and sales; the memory module products include server memory modules (RDIMM), laptop memory modules (SODIMM), and desktop memory modules (UDIMM), with more than 40 models being mass-produced and sold globally. The company has also conducted R&D and layout in the field of embedded storage SRAM and new memory RRAM.
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Xi'an UniIC is dedicated to delivering top-tier services to chip design companies globally. Adopting a flexible business model, the company offers full-flow turnkey chip design service as well as tailored technical support based on client needs. This helps clients achieve cost-effective and efficient productization. The company also aids in outsourcing production management services, including wafer manufacturing, packaging, and testing, to meet the diverse needs of clients both domestically and internationally.
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By focusing on the product realization process, Xi'an UniIC has established a comprehensive lifecycle quality management system, i.e., product initiation, design and development, procurement, outsourced production management, testing, shipping, and after-sales support—all within the scope of the quality management system. The Quality and Reliability Engineering Department of Xi'an UniIC is deeply involved in quality management activities throughout the entire product lifecycle. This involvement ensures high-quality support for relevant management processes, guaranteeing the continuous provision of high-quality products and customer support.
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Xi'an UniIC, a subsidiary of Tsinghua Unigroup, is a product and service provider focusing on DRAM (Dynamic Random Access Memory) technologies. As a technology-driven comprehensive IC design enterprise, its core business includes standard memory chips, module and system products, embedded DRAM and memory controller chips, as well as ASIC design services.
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Compared to DDR3, DDR4 significantly enhances performance by increasing the core frequency and the number of Bank Groups and supports larger capacities. Simultaneously, it achieves lower power consumption by operating at a lower supply voltage. Additionally, DDR4 introduces new features such as CRC (Cyclic Redundancy Check), CA parity, DBI (Data Bus Inversion), and temperature-compensated refresh (TCSE/TCAR). These additions not only reduce DDR4's power consumption in use but also enhance signal integrity and improve the reliability of data transmission and storage.
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Excel Sheet
Part No. Decoder
C = Commercial Temperature chip (DDR2, DDR3, DDR4: 0°C ~ +95°C; LPDDR2: 0°C ~ +85°C；SDR, DDR: 0°C ~ +70°C)
I = Industrial Temperature chip (DDR2, DDR3: -40°C ~ +95°C; SDR, DDR, LPDDR2, LPDDR4: -40°C ~ +85°C)
A1 = Automotive grade 1(-40°C ~ +125°C)
A2 = Automotive grade 2(-40°C ~ +105°C)
A25 = Automotive grade 2(-40°C ~ +115°C)
A3 = Automotive grade 3(-40°C ~ +95°C)；LPDDR4(-40°C ~ +85°C)
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